DDR3-1866ECC Unbuffer MemoryCL=13
高品質のチップと部材を使用し、規格仕様に準拠するよう製造されたトランセンドのメモリモジュールはベストパフォーマンスを発揮できるよう厳格な検査を行っています。DDR3L DIMMはわずか1.35Vで動作できるので1.5Vのモジュールに比べて最大15%の省電力です。
Underfill provides a strong mechanical bond between key components and the underlying printed circuit board (PCB). By spreading stresses throughout the chip and PCB interface with a mechanical bond, less stress is concentrated on the solder joints, increasing device reliability.
Conformal coatings can be applied via a range of methods including manual brushing, manual spraying, dipping, or by automated spraying machines.
To ensure that all of its devices can be operated under even the harshest conditions, Transcend utilizes wide temperature technology, allowing our flash and DRAM modules to operate and perform reliably in extreme temperatures.
製品のドライバ、マニュアル、よくある質問、ソフトウェアを掲載しています。